Consists of Copper bonded electrodes, connecting system and ground enhancing compound.
- Copper bonded electrodes with coating
thickness of 250+ microns
- Test Clamp, Rod to Conductor connector
of high quality.
- UniEarth Ground Enhancing Compound GEC
an innovative backfill compound.
- Provides high electrical conductivity
and anti-corrosion properties
- Maintenance free, easy installation.
- Projected service life of 15+ years.
- Suitable for most soils.
